64Mb: x4, x8, x16 SDRAM
Package Dimensions
Figure 7: 54-Ball VFBGA (8mm x 8mm) – Package Codes F4/B4
0.65 ±0.05
Seating plane
Solder ball material:
62% Sn, 36% Pb, 2% Ag or
96.5% Sn, 3% Ag, 0.5% Cu
Solder mask defined ball pads:
Ø0.40
C
0.12 C
54X Ø0.45 ±0.05
Solder ball
diameter refers
to post reflow
condition. The pre-
reflow diameter
is 0.42.
Substrate material: Plastic laminate
Mold compound: Epoxy novolac
6.40
0.80
TYP
Ball A1 ID
Ball A1
Ball A1 ID
Ball A9
4.00 ±0.05
6.40
C
L
8.00 ±0.10
3.20
0.80 TYP
C
L
3.20
4.00 ±0.05
1.00 MAX
8.00 ±0.10
1. All dimensions are in millimeters.
2. Recommended pad size = Ø 0.4mm SMD.
Notes:
PDF: 09005aef80725c0b
64mb_x4x8x16_sdram.pdf - Rev. U 05/13 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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