1Gb: x4, x8, x16 DDR2 SDRAM
Packaging
Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16
0.8 ±0.1
Seating
plane
A
0.12 A
84X Ø0.45
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
8 ±0.1
0.25 MIN
Ball A1 ID
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball pads.
Ball A1 ID
9
8
7
3
2
1
A
B
C
D
E
F
G
H
J
11.2 CTR
12.5 ±0.1
0.8 TYP
K
L
M
N
P
R
Exposed
gold-plated pad
1.2 MAX
0.8 TYP
1.0 MAX X 0.7 NOM
nonconductive floating pad
6.4 CTR
1. All dimensions are in millimeters.
Note:
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
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