Maximum rating
M25PX16
9
Maximum rating
Stressing the device outside the ratings listed in Table 12: Absolute maximum ratings may
cause permanent damage to the device. These are stress ratings only, and operation of the
device at these, or any other conditions outside those indicated in the operating sections of
this specification, is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the Numonyx SURE program
and other relevant quality documents.
Table 12. Absolute maximum ratings
Symbol
Parameter
Min
Max
Unit
TSTG
TLEAD
VIO
Storage temperature
–65
150
see(1)
VCC+0.6
4.0
°C
°C
V
Lead temperature during soldering
Input and output voltage (with respect to ground)
Supply voltage
–0.6
–0.6
VCC
V
VPP
Fast Program/Erase voltage(2)
–0.2
10.0
V
VESD
Electrostatic discharge voltage (Human Body model)(3)
–2000
2000
V
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), and the European
directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
2. Avoid applying VPPH to the W/VPP pin during Bulk Erase.
3. JEDEC Std JESD22-A114A (C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).
Table 13. Data Retention
Parameter
Condition
Grade 3, Autograde 6, Grade 6 100000
at 55°C 20
Min
Max
Unit
Program/Erase Cycles
Data Retention
Cycles per Sector
years
48/65
MICRON [ MICRON TECHNOLOGY ]
