Numonyx® Embedded Flash Memory (J3 65 nm) Single Bit per Cell (SBC)
5.0
Maximum Ratings and Operating Conditions
5.1
Absolute Maximum Ratings
Warning:
Stressing the device beyond the “Absolute Maximum Ratings” may cause permanent
damage. These are stress ratings only.
NOTICE: This document contains information available at the time of its release. The specifications are subject to change without
notice. Verify with your local Numonyx sales office that you have the latest datasheet before finalizing a design.
Table 4:
Absolute Maximum Ratings
Parameter
Min
Max
Unit
Notes
Temperature under Bias Expanded (TA, Ambient)
Storage Temperature
–40
–65
–2.0
–2.0
–2.0
—
+85
+125
°C
°C
V
—
—
2
VCC Voltage
+5.6
VCCQ Voltage
+5.6
V
2
Voltage on any input/output signal (except VCC, VCCQ)
ISH Output Short Circuit Current
Notes:
VCCQ (max) + 2.0
100
V
1
mA
3
1.
2.
3.
Voltage is referenced to VSS. During infrequent non-periodic transitions, the voltage potential between VSS and input/
output pins may undershoot to –2.0 V for periods < 20 ns or overshoot to VCCQ (max) + 2.0 V for periods < 20 ns.
During infrequent non-periodic transitions, the voltage potential between VCC and the supplies may undershoot to –2.0
V for periods < 20 ns or VSUPPLY (max) + 2.0 V for periods < 20 ns.
Output shorted for less than one second. No more than one output pin/ball can be shorted at a time.
5.2
Operating Conditions
Warning:
Operations beyond the “Operating Conditions” is not recommended and extended
exposure beyond the “Operating Conditions” may affect device reliability.
Table 5:
Temperature and VCC Operating Condition
Symbol
Parameter
Min
-40.0
Max
Unit
Test Condition
TA
Operating Temperature
VCC Supply Voltage
VCCQ Supply Voltage
+85
3.6
3.6
°C
V
Ambient Temperature
VCC
VCCQ
2.70
2.70
—
—
V
5.3
Power-Up/Down
This section provides an overview of system level considerations with regards to the
flash device. It includes a brief description of power-up/down sequence and decoupling
design considerations.
5.3.1
Power-Up/Down Sequence
To prevent conditions that could result in spurious program or erase operations, the
power-up/power-down sequence shown in Table 6 is recommended. For DC voltage
characteristics refer to Table 8. Note that each power supply must reach its minimum
voltage range before applying/removing the next supply voltage.
Jan 2011
208032-03
Datasheet
19
MICRON [ MICRON TECHNOLOGY ]
