P33-65nm
Table 2:
TSOP Package Dimensions (Sheet 2 of 2)
Millimeters
Inches
Nom
Product Information
Symbol
Note
Min
Nom
Max
Min
Max
Lead Count
N
θ
-
0°
56
3°
-
-
0°
56
3°
-
Lead Tip Angle
5°
5°
Seating Plane Coplanarity
Lead to Package Offset
Notes:
Y
Z
-
-
0.100
0.350
-
-
0.004
0.014
0.150
0.250
0.006
0.010
1.
2.
3.
One dimple on package denotes Pin 1.
If two dimples, then the larger dimple denotes Pin 1.
Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
2.2
64-Ball Easy BGA Package
Figure 3: Easy BGA Mechanical Specifications (256/512-Mbit)
Ball A1
Corner
Ball A1
Corner
D
S1
1
2
3
4
5
6
7
8
8
7
6
5
4
3
2
1
S2
A
B
C
D
E
F
A
B
C
D
E
F
b
e
E
G
H
G
H
Top View - Ball side down
A1
Bottom View - Ball Side Up
A2
A
Seating
Plane
Y
Note: Drawing not to scale
Datasheet
9
Aug 2009
OrderNumber:320003-08
MICRON [ MICRON TECHNOLOGY ]
