欢迎访问ic37.com |
会员登录 免费注册
发布采购

JS28F256P30B 参数 Datasheet PDF下载

JS28F256P30B图片预览
型号: JS28F256P30B
PDF下载: 下载PDF文件 查看货源
内容描述: 美光并行NOR闪存的嵌入式存储器( P30-65nm ) [Micron Parallel NOR Flash Embedded Memory (P30-65nm)]
分类和应用: 闪存存储
文件页数/大小: 98 页 / 1366 K
品牌: MICRON [ MICRON TECHNOLOGY ]
 浏览型号JS28F256P30B的Datasheet PDF文件第18页浏览型号JS28F256P30B的Datasheet PDF文件第19页浏览型号JS28F256P30B的Datasheet PDF文件第20页浏览型号JS28F256P30B的Datasheet PDF文件第21页浏览型号JS28F256P30B的Datasheet PDF文件第23页浏览型号JS28F256P30B的Datasheet PDF文件第24页浏览型号JS28F256P30B的Datasheet PDF文件第25页浏览型号JS28F256P30B的Datasheet PDF文件第26页  
256Mb and 512Mb (256Mb/256Mb), P30-65nm  
Signal Descriptions  
Table 7: TSOP and Easy BGA Signal Descriptions (Continued)  
Symbol  
Type  
Name and Function  
WAIT  
Output  
Wait: Indicates data valid in synchronous array or non-array burst reads. Read configura-  
tion register bit 10 (RCR.10, WT) determines its polarity when asserted. This signal's active  
output is VOL or VOH when CE# and OE# are VIL. WAIT is High-Z if CE# or OE# is VIH.  
• In synchronous array or non-array read modes, this signal indicates invalid data when as-  
serted and valid data when de-asserted.  
• In asynchronous page mode, and all write modes, this signal is de-asserted.  
VCC  
Power  
Device core power supply: Core (logic) source voltage. Writes to the array are inhibited  
when VCC VLKO. Operations at invalid VCC voltages should not be attempted.  
VCCQ  
VSS  
Power  
Power  
Output power supply: Output-driver source voltage.  
Ground: Connect to system ground. Do not float any VSS connection.  
RFU  
Reserved for future use: Reserved by Micron for future device functionality and en-  
hancement. These should be treated in the same way as a DU signal.  
DU  
NC  
Do not use: Do not connect to any other signal, or power supply; must be left floating.  
No connect: No internal connection; can be driven or floated.  
Table 8: QUAD+ SCSP Signal Descriptions  
Symbol  
Type  
Name and Function  
A[MAX:0]  
Input  
Address inputs: Device address inputs. 256Mb: A[23:0]; 512Mb: A[24:0]. Note: The virtual  
selection of the 256Mb top parameter die in the dual-die 512Mb configuration is accom-  
plished by setting A24 HIGH.  
Note: The address pins unused in design should not be left floating; tie them to VCCQ or  
VSS according to specific design requirements. Note: When handling the QUAD + SCSP  
package, note that LSB is A0; address conversion is necessary.  
ADV#  
Input  
Input  
Address valid: Active LOW input. During synchronous READ operations, addresses are  
latched on the rising edge of ADV#, or on the next valid CLK edge with ADV# LOW, which-  
ever occurs first.  
In asynchronous mode, the address is latched when ADV# goes HIGH or continuously flows  
through if ADV# is held LOW.  
Note: Designs not using ADV# must tie it to VSS to allow addresses to flow through.  
F1-CE#  
Flash chip enable: Active LOW input. F1-CE# LOW selects the associated die. When asser-  
ted, internal control logic, input buffers, decoders, and sense amplifiers are active. When  
de-asserted, the associated die is deselected, power is reduced to standby levels, data and  
wait outputs are placed in High-Z.  
Note: F1-CE# must be driven HIGH when device is not in use.  
CLK  
Input  
Input  
Clock: Synchronizes the device with the system bus frequency in synchronous-read mode.  
During synchronous READ operations, addresses are latched on the rising edge of ADV#,  
or on the next valid CLK edge with ADV# LOW, whichever occurs first.  
Note: Designs not using CLK for synchronous read mode must tie it to VCCQ or VSS.  
F1-OE#  
Output enable: Active LOW input. F1-OE# LOW enables the device’s output data buffers  
during READ cycles. F1-OE# HIGH places the data outputs and wait in High-Z.  
PDF: 09005aef84566799  
p30_65nm_MLC_256Mb-512mb.pdf - Rev. C 12/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
22  
© 2013 Micron Technology, Inc. All rights reserved.