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JS28F256P30B 参数 Datasheet PDF下载

JS28F256P30B图片预览
型号: JS28F256P30B
PDF下载: 下载PDF文件 查看货源
内容描述: 美光并行NOR闪存的嵌入式存储器( P30-65nm ) [Micron Parallel NOR Flash Embedded Memory (P30-65nm)]
分类和应用: 闪存存储
文件页数/大小: 98 页 / 1366 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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256Mb and 512Mb (256Mb/256Mb), P30-65nm  
Signal Descriptions  
Signal Descriptions  
Table 7: TSOP and Easy BGA Signal Descriptions  
Symbol  
Type  
Name and Function  
A[MAX:1]  
Input  
Address inputs: Device address inputs.  
Note: Unused active address pins should not be left floating; tie them to VCCQ or VSS ac-  
cording to specific design requirements.  
ADV#  
CE#  
Input  
Input  
Input  
Address valid: Active LOW input. During synchronous READ operations, addresses are  
latched on the rising edge of ADV#, or on the next valid CLK edge with ADV# LOW, which-  
ever occurs first. In asynchronous mode, the address is latched when ADV# goes HIGH or  
continuously flows through if ADV# is held LOW.  
Note: Designs not using ADV# must tie it to VSS to allow addresses to flow through.  
Chip enable: Active LOW input. CE# LOW selects the associated die. When asserted, inter-  
nal control logic, input buffers, decoders, and sense amplifiers are active. When de-asser-  
ted, the associated die is deselected, power is reduced to standby levels, data and wait  
outputs are placed in High-Z.  
Note: CE# must be driven HIGH when device is not in use.  
CLK  
Clock: Synchronizes the device with the system bus frequency in synchronous-read mode.  
During synchronous READs, addresses are latched on the rising edge of ADV#, or on the  
next valid CLK edge with ADV# LOW, whichever occurs first.  
Note:Designs not using CLK for synchronous read mode must tie it to VCCQ or VSS.  
OE#  
Input  
Input  
Output enable: Active LOW input. OE# LOW enables the device’s output data buffers  
during READ cycles. OE# HIGH places the data outputs and WAIT in High-Z.  
RST#  
Reset: Active LOW input. RST# resets internal automation and inhibits WRITE operations.  
This provides data protection during power transitions. RST# HIGH enables normal opera-  
tion. Exit from reset places the device in asynchronous read array mode.  
WP#  
Input  
Write protect: Active LOW input. WP# LOW enables the lock-down mechanism. Blocks in  
lock-down cannot be unlocked with the Unlock command. WP# HIGH overrides the lock-  
down function enabling blocks to be erased or programmed using software commands.  
Note: Designs not using WP# for protection could tie it to VCCQ or VSS without additional  
capacitor.  
WE#  
VPP  
Input  
Write enable: Active LOW input. WE# controls writes to the device. Address and data are  
latched on the rising edge of WE# or CE#, whichever occurs first.  
Power/Input Erase and program power: A valid voltage on this pin allows erasing or programming.  
Memory contents cannot be altered when VPP VPPLK. Block erase and program at invalid  
VPP voltages should not be attempted.  
Set VPP = VPPL for in-system PROGRAM and ERASE operations. To accommodate resistor or  
diode drops from the system supply, the VIH level of VPP can be as low as VPPL,min . VPP must  
remain above VPPL,min to perform in-system modification. VPP may be 0V during READ op-  
erations.  
VPP can be connected to 9V for a cumulative total not to exceed 80 hours. Extended use of  
this pin at 9V may reduce block cycling capability.  
DQ[15:0]  
Input/Output Data input/output: Inputs data and commands during WRITE cycles; outputs data during  
memory, status register, protection register, and read configuration register reads. Data  
balls float when the CE# or OE# are de-asserted. Data is internally latched during writes.  
PDF: 09005aef84566799  
p30_65nm_MLC_256Mb-512mb.pdf - Rev. C 12/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
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© 2013 Micron Technology, Inc. All rights reserved.