PIC16C63A/65B/73B/74B
18.10 44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
E
E1
#leads=n1
D1 D
n 1 2
CH2 x 45
°
CH1 x 45
°
A3
A2
α
35°
A
B1
B
p
D2
c
β
E2
Units
Dimension Limits
n
p
INCHES*
NOM
44
.050
11
.165
.173
.145
.153
.028
.020
.024
.029
.040
.045
.000
.005
.685
.690
.685
.690
.650
.653
.650
.653
.590
.620
.590
.620
.008
.011
.026
.029
.013
.020
0
5
0
5
A1
MIN
MAX
MIN
Number of Pins
Pitch
Pins per Side
n1
Overall Height
A
.180
.160
Molded Package Thickness
A2
.035
Standoff §
A1
A3
Side 1 Chamfer Height
.034
Corner Chamfer 1
CH1
.050
Corner Chamfer (others)
CH2
.010
Overall Width
E
.695
Overall Length
D
.695
Molded Package Width
E1
.656
Molded Package Length
D1
.656
Footprint Width
E2
.630
Footprint Length
.630
D2
c
Lead Thickness
.013
Upper Lead Width
B1
.032
Lower Lead Width
B
.021
α
Mold Draft Angle Top
10
β
Mold Draft Angle Bottom
10
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
MILLIMETERS
NOM
44
1.27
11
4.19
4.39
3.68
3.87
0.71
0.51
0.61
0.74
1.02
1.14
0.00
0.13
17.40
17.53
17.40
17.53
16.51
16.59
16.51
16.59
14.99
15.75
14.99
15.75
0.20
0.27
0.66
0.74
0.33
0.51
0
5
0
5
MAX
4.57
4.06
0.89
0.86
1.27
0.25
17.65
17.65
16.66
16.66
16.00
16.00
0.33
0.81
0.53
10
10
2000 Microchip Technology Inc.
DS30605C-page 163