PIC16C63A/65B/73B/74B
18.9
44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead
Form (MQFP)
E
E1
#leads=n1
p
D1 D
B
n
2
1
CH x 45
°
α
A1
c
A
β
L
φ
(F)
A2
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Units
Dimension Limits
n
p
n1
A
A2
A1
L
(F)
φ
E
D
E1
D1
c
B
CH
α
β
MIN
.079
.077
.002
.029
0
.510
.510
.390
.390
.005
.012
.025
5
5
INCHES
NOM
44
.031
11
.086
.080
.006
.035
.063
3.5
.520
.520
.394
.394
.007
.015
.035
10
10
MAX
MIN
.093
.083
.010
.041
7
.530
.530
.398
.398
.009
.018
.045
15
15
MILLIMETERS*
NOM
44
0.80
11
2.00
2.18
1.95
2.03
0.05
0.15
0.73
0.88
1.60
0
3.5
12.95
13.20
12.95
13.20
9.90
10.00
9.90
10.00
0.13
0.18
0.30
0.38
0.64
0.89
5
10
5
10
MAX
2.35
2.10
0.25
1.03
7
13.45
13.45
10.10
10.10
0.23
0.45
1.14
15
15
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-022
Drawing No. C04-071
DS30605C-page 162
2000 Microchip Technology Inc.
MICROCHIP [ MICROCHIP TECHNOLOGY ]
