PIC16C63A/65B/73B/74B
18.8
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form
(TQFP)
E
E1
#leads=n1
p
D1
D
B
n
2
1
CH x 45
°
A
α
c
β
φ
L
A1
(F)
Units
Dimension Limits
n
p
n1
A
A2
A1
L
(F)
φ
E
D
E1
D1
c
B
CH
α
β
INCHES
NOM
44
.031
11
.043
.039
.004
.024
.039
3.5
.472
.472
.394
.394
.006
.015
.035
10
10
MILLIMETERS*
NOM
44
0.80
11
1.00
1.10
0.95
1.00
0.05
0.10
0.45
0.60
1.00
0
3.5
11.75
12.00
11.75
12.00
9.90
10.00
9.90
10.00
0.09
0.15
0.30
0.38
0.64
0.89
5
10
5
10
A2
MIN
MAX
MIN
MAX
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
.039
.037
.002
.018
0
.463
.463
.390
.390
.004
.012
.025
5
5
.047
.041
.006
.030
7
.482
.482
.398
.398
.008
.017
.045
15
15
1.20
1.05
0.15
0.75
7
12.25
12.25
10.10
10.10
0.20
0.44
1.14
15
15
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
2000 Microchip Technology Inc.
DS30605C-page 161
MICROCHIP [ MICROCHIP TECHNOLOGY ]
