PIC16F/LF1946/47
29.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No.
Sym.
JA
Characteristic
Typ.
Units
Conditions
64-pin TQFP package
48.3
28
C/W
C/W
C/W
C/W
C
TH01
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
64-pin QFN package
64-pin TQFP package
64-pin QFN package
TH02
JC
26.1
0.24
150
—
TH03
TH04
TH05
TH06
TH07
TJMAX
PD
Maximum Junction Temperature
Power Dissipation
W
PD = PINTERNAL + PI/O
PINTERNAL = IDD x VDD
(1)
PINTERNAL Internal Power Dissipation
—
W
PI/O
I/O Power Dissipation
Derated Power
—
W
PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
(2)
PDER
—
W
PDER = PDMAX (TJ - TA)/JA
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
DS41414A-page 394
Preliminary
2010 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
