MCP414X/416X/424X/426X
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in
Additional descriptions of the device pins follows.
TABLE 3-1:
PINOUT DESCRIPTION FOR THE MCP414X/416X/424X/426X
Pin
Weak
Pull-up/
down
“smart”
“smart”
“smart”
“smart”
—
No
No
No
No
No
No
“smart”
“smart”
No
—
—
—
Single
Rheo Pot
8L
1
2
3
—
4
—
—
—
—
5
6
—
—
7
8
—
9
Legend:
(1)
Dual
Rheo
10L
1
2
3
—
4
5
6
—
—
7
8
—
—
9
10
—
11
14L
1
2
3
—
4
5
6
7
8
9
10
11
12
13
14
—
—
Pot
16L
16
1
2
—
3, 4
5
6
7
8
9
10
12
13
14
15
11
17
CS
SCK
SDI
SDI/SDO
V
SS
P1B
P1W
P1A
P0A
P0W
P0B
WP
SHDN
SDO
V
DD
NC
EP
I
I
I
I/O
—
A
A
A
A
A
A
I
I
O
—
—
—
HV w/ST
HV w/ST
HV w/ST
HV w/ST
P
Analog
Analog
Analog
Analog
Analog
Analog
I
HV w/ST
O
P
—
—
Symbol
I/O
Buffer
Type
Standard Function
8L
1
2
—
3
4
—
—
—
5
6
7
—
—
—
8
—
9
SPI Chip Select Input
SPI Clock Input
SPI Serial Data Input
SPI Serial Data Input/Output
Ground
Potentiometer 1 Terminal B
Potentiometer 1 Wiper Terminal
Potentiometer 1 Terminal A
Potentiometer 0 Terminal A
Potentiometer 0 Wiper Terminal
Potentiometer 0 Terminal B
Hardware
Protect
EEPROM
Write
Hardware Shutdown
SPI Serial Data Out
Positive Power Supply Input
No Connection
Exposed Pad.
HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals)
I = digital input (high Z)
O = digital output
I/O = Input / Output
P = Power
The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin
(SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been
requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin.
The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and shut-
down current.
The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be
at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up,
customers can increase the rate with external pull-up resistors.
The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s V
SS
pin.
Note 1:
2:
3:
4:
©
2008 Microchip Technology Inc.
DS22059B-page 27
MICROCHIP [ MICROCHIP TECHNOLOGY ]
