AT24C32D
Packaging Information
d
0.10 (4X)
d
0.08 C
f
0.10
C
A
E
C
D
2.
b
j
j
n 0.15m
0.08m
C
C
A B
n
B
PIN 1 BALL PAD CORNER
A1
A2
A
TOP VIEW
SIDE VIEW
PIN 1 BALL PAD CORNER
4
3
1
2
d
(d1)
6
5
8
7
COMMON DIMENSIONS
(Unit of Measure - mm)
e
(e1)
SYMBOL
NOM
MIN
MAX
NOTE
0.73
0.09
0.40
0.20
0.79
0.85
0.19
0.50
0.30
A
A1
A2
b
BOTTOM VIEW
8 SOLDER BALLS
0.14
0.45
Notes:
1. This drawing is for general information only.
0.25
2
1.50 BSC
2.0 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
D
E
2. Dimension ‘b’ is measured at maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
e
e1
d
d1
7/1/14
REV.
TITLE
DRAWING NO.
8U3-1
GPC
GXU
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)
G
Note:ꢀ For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
DS20006047A-page 34
Datasheet
© 2018 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
