AT24C32D
Revision History
11.
Revision History
Atmel Document 8866 revision A (August 2013)
Split AT24C32D from AT24C64D due to growing differences in package offerings. Added 5-ball WLCSP
package. Updated template and Atmel logos.
Atmel Document 8866 revision B (January 2015)
Added the UDFN Expanded Quantity Option. Updated the 8X and 8MA2 package outline drawings, the
part markings page, and the ordering information section
Atmel Document 8866 revision C (December 2015)
Add the AT24C32D-STUMHY-T option and updated the 8S1 and 8MA2 package drawings.
Atmel Document 8866 revision D (December 2016)
Removed AT24C32D-STUMHY-T part number from data sheet.
Removed Product Variation code from Ordering Code Detail.
Part marking SOT23:
- Moved backside mark (YMXX) to front side line2.
- Added @ = Country of Assembly.
Revision A (September 2018)
Updated to the Microchip template. Microchip DS20006047 replaces Atmel document 8866. Corrected
tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns. Updated Part Marking
Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation.
Updated trace code format in package markings. Updated section content throughout for clarification.
Added a figure for “System Configuration Using 2-Wire Serial EEPROMs”. Added POR recommendations
section. Removed the 5-ball WLCSP package offering. Replaced the 8U2-1 VFBGA Package Outline
Drawing with the 8U3-1 VFBGA Package Outline Drawing. Updated the SOIC, TSSOP and UDFN
package drawings to Microchip format.
DS20006047A-page 36
Datasheet
© 2018 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
