AT24C32D
Packaging Information
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
MILLIMETERS
NOM
MIN
MAX
Number of Terminals
Pitch
Overall Height
Standoff
Terminal Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Terminal Width
Terminal Length
N
8
e
0.50 BSC
0.55
0.02
0.152 REF
2.00 BSC
1.50
3.00 BSC
1.30
A
A1
A3
D
D2
E
E2
b
L
0.50
0.00
0.60
0.05
1.40
1.60
1.20
0.18
0.35
0.20
1.40
0.30
0.45
-
0.25
0.40
-
Terminal-to-Exposed-Pad
K
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2
DS20006047A-page 32
Datasheet
© 2018 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
