AT24C32D
Packaging Information
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
G2
8
ØV
C
Y2
G1
Y1
1
2
SILK SCREEN
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
MILLIMETERS
NOM
0.50 BSC
MIN
MAX
Contact Pitch
Optional Center Pad Width
Optional Center Pad Length
Contact Pad Spacing
X2
Y2
C
1.60
1.40
2.90
Contact Pad Width (X8)
Contact Pad Length (X8)
Contact Pad to Center Pad (X8)
Contact Pad to Contact Pad (X6)
Thermal Via Diameter
X1
Y1
G1
G2
V
0.30
0.85
0.20
0.33
0.30
1.00
Thermal Via Pitch
EV
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-21355-Q4B Rev A
DS20006047A-page 33
Datasheet
© 2018 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
