AT24C32D
Packaging Information
e1
C
4
5
E1
C
L
E
L1
3
1
2
TOP VIEW
END VIEW
b
A2
A
SEATING
PLANE
A1
e
D
SIDE VIEW
COMMON DIMENSIONS
(Unit of Measure = mm)
1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash,
protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does
not include interlead flash or protrusion. Interlead flash or protrusion shall not
exceed 0.15 mm per side.
2. The package top may be smaller than the package bottom. Dimensions D and E1
are determined at the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch
between the top and bottom of the plastic body.
3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15
mm from the lead tip.
4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the "b" dimension at maximum material
condition. The dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and an adjacent lead shall not be less than 0.07 mm.
SYMBOL
MIN
—
NOM
—
MAX
1.00
0.10
1.00
0.20
NOTE
A
A1
A2
c
0.00
0.70
0.08
—
0.90
—
3
D
2.90 BSC
2.80 BSC
1.60 BSC
0.60 REF
0.95 BSC
1.90 BSC
—
1,2
1,2
1,2
E
E1
L1
e
This drawing is for general information only. Refer to JEDEC
Drawing MO-193, Variation AB for additional information.
e1
b
0.30
0.50
3,4
2/2/16
REV.
TITLE
GPC
TSZ
DRAWING NO.
5TS1
5TS1, 5-lead 1.60mm Body, Plastic Thin
Shrink Small Outline Package (Shrink SOT)
E
Note:ꢀ For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging.
DS20006047A-page 30
Datasheet
© 2018 Microchip Technology Inc.
MICROCHIP [ MICROCHIP ]
