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25LC512-E/MF 参数 Datasheet PDF下载

25LC512-E/MF图片预览
型号: 25LC512-E/MF
PDF下载: 下载PDF文件 查看货源
内容描述: 512 Kbit的SPI总线串行EEPROM [512 Kbit SPI Bus Serial EEPROM]
分类和应用: 可编程只读存储器电动程控只读存储器电可擦编程只读存储器
文件页数/大小: 32 页 / 602 K
品牌: MICROCHIP [ MICROCHIP ]
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25AA512/25LC512  
Release from Deep Power-Down mode and Read  
Electronic Signature is entered by driving CS low,  
followed by the RDID instruction code (Figure 2-12)  
and then a dummy address of 16 bits (A15-A0). After  
the last bit of the dummy address is clock in, the 8-bit  
Electronic Signature is clocked out on the SO pin.  
2.12 RELEASE FROM DEEP POWER-  
DOWN AND READ ELECTRONIC  
SIGNATURE  
Once the device has entered Deep Power-Down  
mode all instructions are ignored except the Release  
from Deep Power-down and Read Electronic Signa-  
ture command. This command can also be used when  
the device is not in Deep power-down to read the  
electronic signature out on the SO pin unless another  
command is being executed such as Erase, Program  
or Write Status Register.  
After the signature has been read out at least once,  
the sequence can be terminated by driving CS high.  
The device will then return to Standby mode and will  
wait to be selected so it can be given new instructions.  
If additional clock cycles are sent after the electronic  
signature has been read once, it will continue to output  
the signature on the SO line until the sequence is  
terminated.  
FIGURE 2-12:  
RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE  
CS  
0
1
2
3
4
5
6
7
8
9 10 11  
21 22 23 24 25 26 27 28 29 30 31  
SCK  
Instruction  
16-bit Address  
15 14 13 12  
1
0
1
0
1
0
1
1
2
1
0
SI  
Electronic Signature Out  
High-Impedance  
7
6
5
4
3
2
1
0
SO  
0
0
1
0
1
0
0
1
Manufacturer’s ID = 0x29  
Driving CS high after the 8-bit RDID command but before the Electronic Signature has been transmitted will still ensure  
the device will be taken out of Deep Power-Down mode. However, there is a delay TREL that occurs before the device  
returns to Standby mode (ICCS), as shown in Figure 2-13.  
FIGURE 2-13:  
RELEASE FROM DEEP POWER-DOWN AND READ ELECTRONIC SIGNATURE  
CS  
TREL  
0
1
2
3
4
5
6
7
SCK  
SI  
Instruction  
1
0
1
0
1
0
1
1
High-Impedance  
SO  
DS22021B-page 18  
Preliminary  
© 2007 Microchip Technology Inc.  
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