24C01SC/02SC
8.0
8.1
PAD DESCRIPTIONS
SDA Serial Address/Data Input/Output
9.0
DIE CHARACTERISTICS
This is a bi-directional pad used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to V
CC
(typical 10KΩ for 100 kHz, 1KΩ for 400
kHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are reserved
for indicating the START and STOP conditions.
including bondpad positions. Table 9-1 shows the
actual coordinates of the bondpad midpoints with
respect to the center of the die.
FIGURE 9-1:
DIP
V
SS
DIE LAYOUT
V
CC
8.2
SCL Serial Clock
SDA
DC
SCL
This input is used to synchronize the data transfer from
and to the device.
8.3
DC Don’t Connect
TABLE 9-1:
Pad Name
This pad is used for test purposes and should not be
bonded out. It will be pulled to V
SS
through an internal
resistor.
BONDPAD COORDINATES
Pad Midpoint,
X dir.
Pad Midpoint,
Y dir.
-495.000
749.130
V
SS
SDA
-605.875
-271.875
SCL
479.875
-746.625
V
CC
605.875
-261.375
Note 1: Dimensions are in microns.
2: Center of die is at the 0,0 point.
DS21170A-page 8
Preliminary
©
1996 Microchip Technology Inc.
MICROCHIP [ MICROCHIP TECHNOLOGY ]
