WS512K32-XXX
ORDERING INFORMATION
W S 512K 32 X - XXX X X X
MICROSEMI CORPORATION
SRAM
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
IMPROVEMENT MARK:
Blank = Standard Power
N
L
= No Connect at pin 21 and 39 in HIP for Upgrades
= Low Power Data Retention
ACCESS TIME (ns)
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T* = 40mm Low Profile CQFP (Package 502)
DEVICE GRADE:
Q
M
I
= Military Grade**
= Military Screened
= Industrial
-55°C to +125°C
-40°C to 85°C
0°C to +70°C
C
= Commercial
LEAD FINISH:
Blank = Gold plated leads
A
= Solder dip leads
* Package Not Recommended For New Design
** This product is processed the same as the 5962-XXXXXHXX product but all
test and mechanical requirements are per the Microsemi data sheet.
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2016 © 2016 Microsemi Corporation. All rights reserved.
Rev. 22
8
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp
MERCURY [ MERCURY UNITED ELECTRONICS INC ]
