WS512K32-XXX
Document Title
512K x 32 SRAM Multi-Chip Package
Revision History
Rev # History
Release Date Status
Rev 14
Rev 15
Rev 16
Rev 17
Change (Pg. 1,3,11)
14.1 Change IOL to 6mA for 15-35 ns
May 2004
Final
Final
Final
Final
Change (Pg. 1,4,11)
15.1 Add 15ns for Military Temperature
November 2004
March 2006
May 2006
Change (Pg. 1, 6, 11)
16.1 Correct thickness to 0.181"per PCN#140A00143
Change ( Pg. 1, 2, 11)
17.1 Correct pinout of G4T
17.2 Correct G2L foot length
Rev 18
Rev 19
Change (Pg. 6)
18.1 Change drawing on HIP to generic square drawing
November 2010
September 2011
Final
Final
Change (Pg. 8)
19.1 Swap positions with 'Access Time' and 'Improvement Mark' in the 'Ordering Information' chart
Rev 20
Rev 21
Rev 22
Change (Pg. 8)
May 2014
Final
Final
Final
20.1 Changed Device Grade "Q" description from "MIL-STD-883 Compliant" to
"MIL-PRF-38534 Class H Compliant."
Change (Pg. 8)
August 2014
April 2016
21.1 Changed Device Grade "Q" description from "MIL-PRF-38534 Class H
Compliant." to "Military Grade."
Change (Pg. 7) (ECN 9936)
22.1 Update package 510 dimensions
Microsemi Corporation reserves the right to change products or specifications without notice.
April 2016 © 2016 Microsemi Corporation. All rights reserved.
Rev. 22
11
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