W3H32M64EA-XSBX
ADVANCED
FIGURE 14 – PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
BOTTOM VIEW
208 x Ø 0.60 (0.024) NOM
11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
1.0 (0.039)NOM
0.50
(0.020)
NOM
10.0 (0.394) NOM
16.15 (0.636) MAX
2.56 (0.100) MAX
All linear dimensions are millimeters and parenthetically in inches
Microsemi Corporation reserves the right to change products or specifications without notice.
August 2011 © 2011 Microsemi Corporation. All rights reserved.
Rev.1
25
Microsemi Corporation • (602) 437-1520 • www.microsemi.com