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W3H32M64EA-400SBM 参数 Datasheet PDF下载

W3H32M64EA-400SBM图片预览
型号: W3H32M64EA-400SBM
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 27 页 / 1197 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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W3H32M64EA-XSBX  
ADVANCED  
TABLE 11 – DDR2 ICC SPECIFICATIONS AND CONDITIONS  
VCC = 1.8V ±0.1V; -55°C TA 125°C  
Symbol  
667 CL5  
533 CL4  
400 CL3  
Units  
Proposed Conditions  
Operating one bank active-precharge current;  
CK = tCK(ICC), tRC = tRC(ICC), tRAS = tRASmin(ICC); CKE is HIGH, CS# is HIGH between valid  
ICC0  
t
500  
600  
440  
440  
mA  
commands; Address bus inputs are SWITCHING; Data bus inputs are SWITCHING  
Operating one bank active-read-precharge current;  
IOUT = 0mA; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC), tRC = tRC (ICC), tRAS = tRASmin(ICC), tRCD  
ICC1  
540  
520  
mA  
= tRCD(ICC); CKE is HIGH, CS# is HIGH between valid commands; Address bus inputs are  
SWITCHING; Data pattern is same as IDAD6W  
Precharge power-down current;  
ICC2P  
ICC2Q  
ICC2N  
All banks idle; tCK = tCK(ICC); CKE is LOW; Other control and address bus inputs are STABLE; Data  
bus inputs are FLOATING  
28  
28  
28  
mA  
mA  
mA  
Precharge quiet standby current;  
All banks idle; tCK = tCK(ICC); CKE is HIGH, CS# is HIGH; Other control and address bus inputs are  
STABLE; Data bus inputs are FLOATING  
220  
240  
180  
200  
160  
180  
Precharge standby current;  
All banks idle; tCK = tCK(ICC); CKE is HIGH, CS# is HIGH; Other control and address bus inputs are  
SWITCHING; Data bus inputs are SWITCHING  
Active power-down current;  
All banks open; tCK = tCK(ICC); CKE is LOW; Other control and  
address bus inputs are STABLE; Data bus inputs are FLOATING  
Fast PDN Exit MRS(12) = 0  
Slow PDN Exit MRS(12) = 1  
160  
50  
120  
50  
100  
50  
mA  
mA  
ICC3P  
Active standby current;  
All banks open; tCK = tCK(ICC), tRAS = tRASMAX(ICC), tRP = tRP(ICC); CKE is HIGH, CS# is HIGH between  
valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are  
SWITCHING  
ICC3N  
280  
1,000  
940  
240  
820  
780  
200  
640  
620  
mA  
mA  
mA  
Operating burst write current;  
All banks open, Continuous burst writes; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC), tRAS  
=
ICC4W  
tRASMAX(ICC), tRP = tRP(ICC); CKE is HIGH, CS# is HIGH between valid commands; Address bus inputs  
are SWITCHING; Data bus inputs are SWITCHING  
Operating burst read current;  
All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL = CL(ICC), AL = 0; tCK = tCK(ICC), tRAS  
= tRASMAX(ICC), tRP = tRP(ICC); CKE is HIGH, CS# is HIGH between valid commands; Address bus  
inputs are SWITCHING; Data pattern is same as IDAD6W  
ICC4R  
Burst auto refresh current;  
tCK = tCK(ICC); Refresh command at every tRFC(ICC) interval; CKE is HIGH, CS# is HIGH between  
valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are  
SWITCHING  
ICC5  
880  
28  
840  
28  
800  
28  
mA  
mA  
Self refresh current;  
ICC6  
CK and CK# at 0V; CKE 0.2V; Other control and address bus inputs  
are FLOATING; Data bus inputs are FLOATING  
Normal  
Operating bank interleave read current;  
All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(ICC), AL = tRCD(ICC)-1*tCK(ICC); tCK  
=
ICC7  
tCK(ICC), tRC = tRC(ICC), tRRD = tRRD(ICC), tRCD = 1*tCK(ICC); CKE is HIGH, CS# is HIGH between valid  
1,360  
1,360  
1,360  
mA  
commands; Address bus inputs are STABLE during DESELECTs; Data pattern is same as IDAD6R  
;
Refer to the following page for detailed timing conditions  
Microsemi Corporation reserves the right to change products or specications without notice.  
August 2011 © 2011 Microsemi Corporation. All rights reserved.  
Rev.1  
22  
Microsemi Corporation • (602) 437-1520 • www.microsemi.com  
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