W3H32M64EA-XSBX
ADVANCED
TABLE 12 – AC TIMING PARAMETERS
-55°C ≤ TA ≤ +125°C; VCCQ = + 1.8V ± 0.1V, VCC = +1.8V ± 0.1V
667Mbs CL5
Symbol
533Mbs CL4
400Mbs CL3
Unit
Parameter
Min
3,000
3,750
5,000
0.48
Max
8,000
8,000
8,000
0.52
Min
Max
Min
Max
CL=5
CL=4
CL=3
tCK(4)
CK(4)
ps
ps
ps
tCK
tCK
Clock cycle time
t
3,750
5,000
0.48
8,000
8,000
0.52
5,000
5,000
0.48
8,000
8,000
0.52
tCK(3)
tCH
CK high-level width
CK low-level width
tCL
0.48
0.52
0.48
0.52
0.48
0.52
MIN (tCH
tCL)
,
MIN (tCH
tCL)
,
MIN (tCH
tCL)
,
Half clock period
tHP
ps
DQ output access time from CK/CK#
Data-out high impedance window from CK/CK#
Data-out low-impedance window from CK/CK#
DQ and DM input setup time relative to DQS
DQ and DM input hold time relative to DQS
DQ and DM input pulse width (for each input)
Data hold skew factor
tAC
tHZ
-550
+650
-550
+650
-600
+600
ps
ps
ps
ps
ps
tCK
ps
ps
ns
tCK
tCK
ps
tCK
tCK
ps
tCK
tCK
ps
tCK
tCK
tAC(MAX)
tAC(MAX)
tAC(MAX)
tAC(MAX)
tAC(MAX)
tAC(MAX)
tLZ
tAC(MN)
400
tAC(MN)
400
tAC(MN)
450
tDS
tDH
500
500
450
tDIPW
tQHS
tQH
0.35
0.35
0.35
400
400
450
DQ-DQS hold, DQS to first DQ to go nonvalid, per access
Data valid output window (DVW)
tHP - tQHS
tQH - tDQSQ
0.35
0.35
-550
0.2
tHP - tQHS
tQH - tDQSQ
0.35
tHP - tQHS
tQH - tDQSQ
0.35
tDVW
tDQSH
tDQSL
tDQSCK
tDSS
DQS input high pulse width
DQS input low pulse width
0.35
0.35
DQS output access time fromCK/CK#
DQS falling edge to CK rising - setup time
DQS falling edge from CK rising - hold time
O DQS-DQ skew, DOS to last DQ valid, per group, per access
DQS read preamble
+650
-550
+650
-600
+600
0.2
0.2
tDSH
0.2
0.2
0.2
tDQSQ
tRPRE
tRPST
tWPRES
tWPRE
tWPST
300
300
1.1
0.6
350
1.1
0.6
0.9
1.1
0.6
0.9
0.4
0
0.9
0.4
0
DQS read postamble
0.4
DQS write preamble setup time
0
DQS write preamble
0.25
0.4
0.25
0.4
0.25
0.4
DQS write postamble
0.6
0.6
0.6
WL-
TDQSS
WL+
TDQSS
WL-
TDQSS
WL+
TDQSS
WL-
TDQSS
WL+
TDQSS
Write command to first DQS latching transition
tCK
tCK
Positive DQs latch edge to associated edge
tOQSS
-0.18
+0.18
-0.25
+0.25
-0.25
+0.25
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August 2011 © 2011 Microsemi Corporation. All rights reserved.
Rev.1
23
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