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W3H32M64EA-400SBM 参数 Datasheet PDF下载

W3H32M64EA-400SBM图片预览
型号: W3H32M64EA-400SBM
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 32MX64, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 27 页 / 1197 K
品牌: MERCURY [ MERCURY UNITED ELECTRONICS INC ]
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W3H32M64EA-XSBX  
ADVANCED  
The time between the WRITE command and the rst rising DQS  
edge is WL ± c. Subsequent DQS positive rising edges are timed,  
relative to the associated clock edge, as ± tDQSS. tDQSS is specied  
with a relatively wide range (25 percent of one clock cycle). All  
of the WRITE diagrams show the nominal case, and where the  
two extreme cases (tDQSS [MIN] and tDQSS [MAX]) might not be  
intuitive, they have also been included. Upon completion of a  
burst, assuming no other commands have been initiated, the DQ  
will remain High-Z and any additional input data will be ignored.  
WRITE COMMAND  
The WRITE command is used to initiate a burst write access to  
an active row. The value on the bank address inputs selects the  
bank, and the address provided on inputsA0–9 selects the starting  
column location. The value on input A10 determines whether or  
not auto precharge is used. If auto precharge is selected, the  
row being accessed will be precharged at the end of the WRITE  
burst; if auto precharge is not selected, the row will remain open  
for subsequent accesses.  
Data for any WRITE burst may be concatenated with a subsequent  
WRITE command to provide continuous ow of input data. The rst  
data element from the new burst is applied after the last element  
of a completed burst. The new WRITE command should be issued  
x cycles after the rst WRITE command, where x equals BL/2.  
Input data appearing on the DQ is written to the memory array  
subject to the DM input logic level appearing coincident with the  
data. If a given DM signal is registered LOW, the corresponding  
data will be written to memory; if the DM signal is registered HIGH,  
the corresponding data inputs will be ignored, and a WRITE will  
not be executed to that byte/column location.  
DDR2 SDRAM supports concurrent auto precharge options, as  
shown in Table 4.  
WRITE OPERATION  
DDR2 SDRAM does not allow interrupting or truncating any WRITE  
burst using BL = 4 operation. Once the BL = 4 WRITE command is  
registered, it must be allowed to complete the entire WRITE burst  
cycle. However, a WRITE (with auto precharge disabled) using BL  
= 8 operation might be interrupted and truncated ONLY by another  
WRITE burst as long as the interruption occurs on a 4-bit boundary,  
due to the 4n prefetch architecture of DDR2 SDRAM. WRITE burst  
BL = 8 operations may not to be interrupted or truncated with any  
command except another WRITE command.  
WRITE bursts are initiated with a WRITE command, as shown in  
Figure 12. DDR2 SDRAM uses WL equal to RL minus one clock  
cycle [WL = RL - 1CK = AL + (CL - 1CK)]. The starting column and  
bank addresses are provided with the WRITE command, and auto  
precharge is either enabled or disabled for that access. If auto  
precharge is enabled, the row being accessed is precharged at the  
completion of the burst. For the generic WRITE commands used  
in the following illustrations, auto precharge is disabled.  
Data for any WRITE burst may be followed by a subsequent READ  
command. The number of clock cycles required to meet tWTR is  
either 2 or tWTR/tCK, whichever is greater. Data for any WRITE burst  
may be followed by a subsequent PRECHARGE command. tWT  
starts at the end of the data burst, regardless of the data mask  
condition.  
During WRITE bursts, the first valid data-in element will be  
registered on the rst rising edge of DQS following the WRITE  
command, and subsequent data elements will be registered on  
successive edges of DQS. The LOW state on DQS between the  
WRITE command and the rst rising edge is known as the write  
preamble; the LOW state on DQS following the last data-in element  
is known as the write postamble.  
Microsemi Corporation reserves the right to change products or specications without notice.  
August 2011 © 2011 Microsemi Corporation. All rights reserved.  
Rev.1  
17  
Microsemi Corporation • (602) 437-1520 • www.microsemi.com  
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