LT3505
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
R = 0.115
0.38 0.10
8
TYP
5
0.675 0.05
3.5 0.05
2.15 0.05 (2 SIDES)
1.65 0.05
3.00 0.10
(4 SIDES)
1.65 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
PACKAGE
OUTLINE
(DD) DFN 1203
4
1
0.75 0.05
0.25 0.05
0.200 REF
0.25 0.05
0.50 BSC
0.50
BSC
2.38 0.05
(2 SIDES)
2.38 0.10
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
1. DRAWING TO BE MADE A JEDEC PACKAGE
OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
0.889 0.127
(.035 .005)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.794 0.102
(.110 .004)
3.00 0.102
0.52
(.0205)
REF
(.118 .004)
(NOTE 3)
2.06 0.102
(.081 .004)
1
8
7 6
5
1.83 0.102
(.072 .004)
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
2.083 0.102
(.082 .004)
3.00 0.102
(.118 .004)
(NOTE 4)
4.90 0.152
(.193 .006)
0.65
(.0256)
BSC
0.42 0.038
(.0165 .0015)
TYP
8
1
2
3
4
RECOMMENDED SOLDER PAD LAYOUT
1.10
(.043)
MAX
0.86
(.034)
REF
DETAIL “A”
DETAIL “A”
0° – 6° TYP
0.254
(.010)
0.18
(.007)
SEATING
PLANE
GAUGE PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.127 0.076
(.005 .003)
0.65
(.0256)
BSC
0.53 0.152
(.021 .006)
MSOP (MS8E) 0603
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3505fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
23
Linear [ Linear ]
