LTC5588-1
PACKAGE DESCRIPTION
PF Package
Variation: PF24MA
24-Lead Plastic UTQFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1834 Rev Ø)
2.50 REF
0.70 p 0.05
0.41
p 0.05
0.41 p 0.05
2.45 p 0.05
4.50 p 0.05
3.10 p 0.05
1.24 p0.05
0.41
p 0.05
PACKAGE OUTLINE
0.25 p 0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PIN 1 NOTCH
R = 0.20 TYP
OR 0.25 s 45o
CHAMFER
BOTTOM VIEW—EXPOSED PAD
2.50 REF
0.55 p 0.05
R = 0.05
TYP
4.00 p 0.10
23
24
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
1
2
4.00 p 0.10
2.45 p 0.10
1.24 p 0.10
0.41 p 0.10
0.41
R = 0.125
TYP
p 0.10
(PF24MA) UTQFN 0908 REV Ø
0.125 REF
0.25 p 0.05
0.50 BSC
0.00 – 0.05
0.41 p 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
55881fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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Linear [ Linear ]
