LTC1733
U
PACKAGE DESCRIPTIO
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1663)
BOTTOM VIEW OF
EXPOSED PAD OPTION
2.06 ± 0.102
(.081 ± .004)
2.794 ± 0.102
(.110 ± .004)
0.889 ± 0.127
(.035 ± .005)
1
1.83 ± 0.102
(.072 ± .004)
5.23
(.206)
MIN
2.083 ± 0.102 3.2 – 3.45
(.082 ± .004) (.126 – .136)
10
0.50
(.0197)
BSC
0.305 ± 0.038
(.0120 ± .0015)
TYP
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
0.497 ± 0.076
(.0196 ± .003)
REF
10 9
8
7 6
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
NOTE 4
4.88 ± 0.10
(.192 ± .004)
DETAIL “A”
0.254
(.010)
0° – 6° TYP
1
2
3
4 5
GAUGE PLANE
0.53 ± 0.01
(.021 ± .006)
0.86
(.034)
REF
1.10
(.043)
MAX
DETAIL “A”
0.18
(.007)
SEATING
PLANE
0.17 – 0.27
(.007 – .011)
0.13 ± 0.05
(.005 ± .002)
MSOP (MSE) 1001
0.50
(.0197)
TYP
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
sn1733 1733fs
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tationthattheinterconnectionofitscircuitsasdescribedhereinwillnotinfringeonexistingpatentrights.
15
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