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LCXW 参数 Datasheet PDF下载

LCXW图片预览
型号: LCXW
PDF下载: 下载PDF文件 查看货源
内容描述: 1.1A ,低噪声,低压差线性稳压器 [1.1A, Low Noise, Low Dropout Linear Regulator]
分类和应用: 稳压器
文件页数/大小: 16 页 / 205 K
品牌: Linear [ Linear ]
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LT1965  
APPLICATIONS INFORMATION  
The following tables list thermal resistance for several  
different board sizes and copper areas. All measurements  
were taken in still air on 1/16" FR-4 board with one ounce  
copper.  
Calculating Junction Temperature  
Example:Givenanoutputvoltageof2.5V, aninputvoltage  
range of 3.3V 5%, an output current range of 0mA to  
500mA and a maximum ambient temperature of 85°C,  
what will the maximum junction temperature be?  
Table 1. Measured Thermal Resistance for DFN Package  
Copper Area  
Topside* Backside  
Thermal Resistance  
The power dissipated by the device equals:  
Board Area (Junction-to-Ambient)  
2
2
2
2
2
2
2
2500mm  
1000mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
60°C/W  
62°C/W  
65°C/W  
68°C/W  
70°C/W  
I
• (V  
– V ) + I  
• V  
OUT(MAX)  
IN(MAX)  
OUT  
GND IN(MAX)  
2
2
2
2
2
2
where:  
225mm  
100mm  
2
I
= 500mA  
= 3.465V  
OUT(MAX)  
2
50mm  
V
*Device is mounted on topside  
IN(MAX)  
I
at (I = 500mA, V = 3.465V) = 8.2mA  
OUT IN  
GND  
Table 2. Measured Thermal Resistance for MSOP Package  
Copper Area  
Topside* Backside  
Thermal Resistance  
So,  
Board Area (Junction-to-Ambient)  
P = 500mA(3.465V – 2.5V) + 8.2mA(3.465V) = 0.511W  
2
2
2
2
2
2
2
2500mm  
1000mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
55°C/W  
57°C/W  
60°C/W  
65°C/W  
68°C/W  
2
2
2
2
2
Using a DFN package, the thermal resistance will be in  
the range of 60°C/W to 70°C/W depending on the cop-  
per area. So the junction temperature rise above ambient  
approximately equals:  
2
225mm  
100mm  
2
2
50mm  
*Device is mounted on topside  
0.511W • 65°C/W = 33.22°C  
Table 3. Measured Thermal Resistance for DD-PAK Package  
The maximum junction temperature equals the maximum  
ambienttemperatureplusthemaximumjunctiontempera-  
ture rise above ambient or:  
Copper Area  
Topside* Backside  
Thermal Resistance  
Board Area (Junction-to-Ambient)  
2
2
2
2
2
2500mm  
1000mm  
125mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
2500mm  
25°C/W  
30°C/W  
35°C/W  
2
2
2
T
= 85°C + 33.22°C = 118.22°C  
JMAX  
2
*Device is mounted on topside  
Measured Thermal Resistance for TO-220 Package  
Thermal Resistance (Junction-to-Case) = 3°C/W  
1965f  
11