LT1965
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
R = 0.115
0.38 ± 0.10
TYP
5
8
0.675 ±0.05
3.5 ±0.05
2.15 ±0.05 (2 SIDES)
1.65 ±0.05
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
PACKAGE
OUTLINE
(DD) DFN 1203
4
1
0.25 ± 0.05
0.25 ± 0.05
0.75 ±0.05
0.200 REF
0.50 BSC
2.38 ±0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
(2 SIDES)
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
MS8E Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662)
BOTTOM VIEW OF
EXPOSED PAD OPTION
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
0.52
(.0205)
REF
2.06 ± 0.102
(.081 ± .004)
0.889 ± 0.127
(.035 ± .005)
2.794 ± 0.102
(.110 ± .004)
1
8
7 6 5
1.83 ± 0.102
(.072 ± .004)
5.23
(.206)
MIN
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
3.20 – 3.45
(.126 – .136)
4.90 ± 0.152
(.193 ± .006)
2.083 ± 0.102
(.082 ± .004)
0.65
(.0256)
BSC
0.42 ± 0.038
(.0165 ± .0015)
TYP
8
1
2
3
4
RECOMMENDED SOLDER PAD LAYOUT
1.10
(.043)
MAX
0.86
(.034)
REF
DETAIL “A”
DETAIL “A”
0.254
0.18
(.007)
(.010)
0° – 6° TYP
SEATING
PLANE
GAUGE
PLANE
0.22 – 0.38
(.009 – .015)
TYP
0.127 ± 0.076
(.005 ± .003)
0.65
(.0256)
BSC
0.53 ± 0.152
(.021 ± .006)
MSOP (MS8E) 0603
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR
GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.152mm (.006") PER SIDE
1965f
14