LT1965
PACKAGE DESCRIPTION
Q Package
5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461)
.390 – .415
(9.906 – 10.541)
.060
.256
.165 – .180
(4.191 – 4.572)
(1.524)
(6.502)
.045 – .055
(1.143 – 1.397)
15° TYP
+.008
.004
.060
(1.524)
TYP
–.004
.060
.059
(1.499)
TYP
.183
(1.524)
(4.648)
+0.203
–0.102
.330 – .370
0.102
(
)
(8.382 – 9.398)
.095 – .115
(2.413 – 2.921)
.075
(1.905)
.067
(1.702)
BSC
.050 ± .012
(1.270 ± 0.305)
.300
(7.620)
.013 – .023
(0.330 – 0.584)
+.012
.143
–.020
.028 – .038
(0.711 – 0.965)
TYP
+0.305
BOTTOM VIEW OF DD PAK
HATCHED AREA IS SOLDER PLATED
COPPER HEAT SINK
3.632
Q(DD5) 0502
(
)
–0.508
.080
.420
.276
.420
.350
.090
.325
.205
.565
.565
.320
.090
.042
.067
.042
RECOMMENDED SOLDER PAD LAYOUT
.067
NOTE:
1. DIMENSIONS IN INCH/
(MILLIMETER)
RECOMMENDED SOLDER PAD LAYOUT
FOR THICKER SOLDER PASTE APPLICATIONS
2. DRAWING NOT TO SCALE
T Package
5-Lead Plastic TO-220 (Standard)
(Reference LTC DWG # 05-08-1420)
.165 – .180
(4.191 – 4.572)
.147 – .155
(3.734 – 3.937)
DIA
.390 – .415
(9.906 – 10.541)
.045 – .055
(1.143 – 1.397)
.230 – .270
(5.842 – 6.858)
.570 – .620
(14.478 – 15.748)
.620
(15.75)
TYP
.460 – .500
(11.684 – 12.700)
.330 – .370
(8.382 – 9.398)
.700 – .728
(17.78 – 18.491)
.095 – .115
(2.413 – 2.921)
SEATING PLANE
.152 – .202
(3.861 – 5.131)
.155 – .195*
(3.937 – 4.953)
.260 – .320
(6.60 – 8.13)
.013 – .023
(0.330 – 0.584)
.067
BSC
.135 – .165
(3.429 – 4.191)
.028 – .038
(0.711 – 0.965)
(1.70)
* MEASURED AT THE SEATING PLANE
T5 (TO-220) 0801
1965f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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