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GM72V66841CT 参数 Datasheet PDF下载

GM72V66841CT图片预览
型号: GM72V66841CT
PDF下载: 下载PDF文件 查看货源
内容描述: 2,097,152字×8位×4银行同步动态RAM [2,097,152 WORD x 8 BIT x 4 BANK SYNCHRONOUS DYNAMIC RAM]
分类和应用:
文件页数/大小: 57 页 / 591 K
品牌: LG [ LG SEMICON CO.,LTD. ]
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LG Semicon  
GM72V66841CT/CLT  
Refresh  
Clock suspend (Active Power down) mode:  
Auto refresh:  
By driving CKE to Low during a bank-active or  
read/write operation, the synchronous DRAM  
enters Clock suspend mode. During Clock  
suspend mode, external input signals are ignored  
and the internal state is maintained. When CKE  
is driven High, the synchronous DRAM  
terminates Clock suspend mode, and command  
input is enabled from the next cycle. For details,  
refer to the "CKE Truth Table".  
All the banks must be Precharged before  
executing an auto-refresh command. Since the  
auto-refresh command updates the internal  
counter every time it is executed and determines  
the banks and the ROW addresses to be  
refreshed, external address specification is not  
required. The refresh cycle is 4,096 cycles/64ms.  
(4,096 cycles are required to refresh all the ROW  
addresses.) The output buffer becomes High-Z  
after auto-refresh start. In addition, since a  
Precharge has been completed by an internal  
operation after the auto-refresh, an additional  
Precharge operation by the Precharge command  
is not required.  
Power-up sequence:  
During Power-up sequence, the DQM and the  
§Á  
CKE must be set to High. When 200 has past  
after Power on, all banks must be Precharged  
using the Precharge command. After tRP delay,  
set 8 or more auto refresh commands. And set the  
mode register set command to initialize the mode  
register.  
Self refresh:  
After executing a self-refresh command, the self-  
refresh operation continues while CKE is held  
Low. During self-refresh operation, all ROW  
addresses are refreshed by the internal refresh  
timer. A self-refresh is terminated by a self-  
refresh exit command. If you use distributed  
auto-refresh mode with 15.6us interval in normal  
read/write cycle, auto-refresh should be executed  
within 15.6 us immediately after exiting from and  
before entering into self refresh mode. If you use  
address refresh or burst auto-refresh mode in  
normal read/write cycle, 4096 cycles of  
distributed auto-refresh with 15.6us interval  
should be executed within 64 ms immediately  
after exiting from and before entering into self  
refresh mode.  
Others  
Power down mode:  
The synchronous DRAM enters Power down  
mode when CKE goes Low in the IDLE state. In  
Power down mode, Power consumption is  
suppressed by deactivating the input initial  
circuit. Power down mode continues while CKE  
is held Low. In addition, by setting CKE to High,  
the synchronous DRAM exits from the Power  
down mode, and command input is enabled from  
the next cycle. In this mode, internal refresh is  
not performed.  
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