IRS2153(1)D
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All
voltage parameters are absolute voltages referenced to COM, all currents are defined positive into any lead.
The thermal resistance and power dissipation ratings are measured under board mounted and still air
conditions.
Parameter
Symbol
VB
Definition
Min.
-0.3
Max.
625
Units
High side floating supply voltage
VS
High side floating supply offset voltage
High side floating output voltage
Low side output voltage
RT pin current
VB - 25
VS – 0.3
-0.3
VB + 0.3
VB + 0.3
V
VHO
VLO
VCC + 0.3
IRT
-5
5
mA
V
VRT
VCT
ICC
RT pin voltage
-0.3
VCC + 0.3
VCC + 0.3
20
CT pin voltage
-0.3
Supply current (Note 1)
---
mA
V/ns
W
Maximum allowable current at LO and HO due to external
power transistor Miller effect.
IOMAX
-500
500
Allowable offset voltage slew rate
-50
---
50
1.0
dVS/dt
PD
Maximum power dissipation @ TA ≤ +25 ºC, 8-Pin DIP
Maximum power dissipation @ TA ≤ +25 ºC, 8-Pin SOIC
Thermal resistance, junction to ambient, 8-Pin DIP
Thermal resistance, junction to ambient, 8-Pin SOIC
Junction temperature
PD
---
0.625
85
RthJA
RthJA
TJ
---
ºC/W
ºC
---
128
150
150
300
-55
-55
---
TS
Storage temperature
TL
Lead temperature (soldering, 10 seconds)
This IC contains a zener clamp structure between the chip VCC and COM which has a nominal
breakdown voltage of 15.4 V. Please note that this supply pin should not be driven by a DC, low
impedance power source greater than the VCLAMP specified in the Electrical Characteristics section.
Note 1:
2
INFINEON [ Infineon ]
