ISL23428
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
L16.2.6x1.8A
D
A
B
16 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
6
INDEX AREA
SYMBOL
MIN
0.45
NOMINAL
MAX
0.55
NOTES
N
E
A
A1
A3
b
0.50
-
2X
0.10 C
1 2
-
-
0.05
-
2X
0.10 C
0.127 REF
-
TOP VIEW
0.15
2.55
1.75
0.20
0.25
2.65
1.85
5
D
2.60
-
0.10 C
E
1.80
-
C
A
0.05 C
SEATING PLANE
e
0.40 BSC
-
K
0.15
0.35
0.45
-
0.40
0.50
16
4
-
0.45
0.55
-
A1
L
-
SIDE VIEW
L1
N
-
2
e
Nd
Ne
3
PIN #1 ID
L1
K
1 2
4
3
NX L
0
-
12
4
5
NX b
16X
Rev. 5 2/09
(DATUM B)
(DATUM A)
NOTES:
0.10 M C A B
0.05 M C
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
BOTTOM VIEW
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
C
L
(A1)
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
NX (b)
5
L
e
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
SECTION "C-C"
TERMINAL TIP
C C
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
3.00
1.80
1.40
0.90
1.40
2.20
0.40
0.20
0.20
0.40
0.50
10
LAND PATTERN
FN7904.0
August 25, 2011
21
INTERSIL [ Intersil ]
