ISL23428
Package Outline Drawing
M14.173
14 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 3, 10/09
A
1
3
5.00 ±0.10
SEE
DETAIL "X"
14
8
6.40
PIN #1
I.D. MARK
4.40 ±0.10
2
3
1
7
0.20 C B A
B
0.65
0.09-0.20
TOP VIEW
END VIEW
1.00 REF
0.05
H
C
0.90 +0.15/-0.10
1.20 MAX
SEATING
PLANE
GAUGE
PLANE
0.25
5
0.25 +0.05/-0.06
0.10 CBA
0°-8°
0.60 ±0.15
0.05 MIN
0.15 MAX
0.10 C
SIDE VIEW
DETAIL "X"
(1.45)
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
(5.65)
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.80mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead is 0.07mm.
6. Dimension in ( ) are for reference only.
(0.65 TYP)
(0.35 TYP)
7. Conforms to JEDEC MO-153, variation AB-1.
TYPICAL RECOMMENDED LAND PATTERN
FN7904.0
August 25, 2011
20
INTERSIL [ Intersil ]
