3 Volt Intel® Advanced+ Boot Block Flash Memory Stacked-CSP Family
6.0
Migration Guide Information
Typically, it is important to discuss footprint migration compatibility between a new product and
existing products. In this specific case, the Stacked-CSP allows the system designer to remove two
separate memory footprints for individual flash and SRAM and replace them with a single
footprint, thus resulting in an overall reduction in board space required. This implies that a new
printed circuit board would be used to take advantage of this feature.
Since the flash in Stacked-CSP shares the same features as the Advanced+ Boot Block Features,
conversions from the Advanced Boot Block are described in AP-658 Designing for Upgrade to the
Advanced+ Boot Block Flash Memory, order number 292216.
Please contact your local Intel representation for detailed information about specific Flash +
SRAM system migrations.
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Datasheet
INTEL [ INTEL ]
