Ordering Information
Figure 6–1. MAX II Device Packaging Ordering Information
EPM
240
G
T
100
C
3
ES
Family Signature
EPM: MAX II
Optional Suffix
Indicates specific device
options or shipment method
ES: Engineering sample
N: Lead-free packaging
Device Type
240:
570:
1270:
2210:
240 Logic Elements
570 Logic Elements
1,270 Logic Elements
2,210 Logic Elements
Speed Grade
3, 4, or 5 with 3 being the fastest
Product-Line Suffix
Indicates device core voltage
Operating Temperature
C: Commercial temperature (TJ = 0
I: Industrial temperature (TJ = -40
˚
C to 85
C to 100
˚
C)
C)
G:
Blank:
1.8-V VCCINT device
2.5-V or 3.3-V VCCINT device
˚
˚
Package Type
Thin quad flat pack (TQFP)
FineLine BGA
T:
F:
®
M: Micro FineLine BGA
Pin Count
Number of pins for a particular package
6–2
MAX II Device Handbook, Volume 1
Core Version a.b.c variable
Altera Corporation
October 2006
INTEL [ INTEL ]
