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82915GV 参数 Datasheet PDF下载

82915GV图片预览
型号: 82915GV
PDF下载: 下载PDF文件 查看货源
内容描述: Express芯片组 [Express Chipset]
分类和应用:
文件页数/大小: 426 页 / 3241 K
品牌: INTEL [ INTEL ]
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R
9.1.5  
9.1.6  
9.1.7  
9.1.8  
9.1.9  
RID2—Revision Identification (D2:F0)................................................178  
CC—Class Code (D2:F0) ...................................................................178  
CLS—Cache Line Size (D2:F0)..........................................................179  
MLT2—Master Latency Timer (D2:F0)...............................................179  
HDR2—Header Type (D2:F0) ............................................................180  
9.1.10 MMADR—Memory Mapped Range Address (D2:F0) ........................180  
9.1.11 IOBAR—I/O Base Address (D2:F0) ...................................................181  
9.1.12 GMADR—Graphics Memory Range Address (D2:F0).......................182  
9.1.13 GTTADR—Graphics Translation Table Range Address (D2:F0).......183  
9.1.14 SVID2—Subsystem Vendor Identification (D2:F0).............................183  
9.1.15 SID2—Subsystem Identification (D2:F0)............................................184  
9.1.16 ROMADR—Video BIOS ROM Base Address (D2:F0).......................184  
9.1.17 CAPPOINT—Capabilities Pointer (D2:F0) .........................................185  
9.1.18 INTRLINE—Interrupt Line (D2:F0) .....................................................185  
9.1.19 INTRPIN—Interrupt Pin (D2:F0).........................................................185  
9.1.20 MINGNT—Minimum Grant (D2:F0)....................................................186  
9.1.21 MAXLAT—Maximum Latency (D2:F0) ...............................................186  
9.1.22 MCAPPTR—Mirror of Dev0 Capability Pointer (D2:F0)  
(Mirrored_D0_34) ...............................................................................186  
9.1.23 MCAPID—Mirror of Dev0 Capability Identification (D2:F0)  
(Mirrored_D0_E0)...............................................................................186  
9.1.24 MGGC—Mirror of Dev0 GMCH Graphics Control (D2:F0)  
(Mirrored_D0_52) ...............................................................................187  
9.1.25 MDEVENdev0f0—Mirror of Dev0 Device Enable (D2:F0)  
(Mirrored_D0_54) ...............................................................................187  
9.1.26 BSM—Base of Stolen Memory (D2:F0)..............................................187  
9.1.27 MSAC—Multi Size Aperture Control (D2:F0) .....................................188  
9.1.28 PMCAPID—Power Management Capabilities ID (D2:F0)..................188  
9.1.29 PMCAP—Power Management Capabilities (D2:F0)..........................189  
9.1.30 PMCS—Power Management Control/Status (D2:F0) ........................190  
9.1.31 SWSMI—Software SMI (D2:F0) .........................................................191  
9.1.32 ASLE—System Display Event Register (D2:F0) ................................191  
9.1.33 ASLS—ASL Storage (D2:F0) .............................................................192  
10  
Device 2 Function 1 (D2:F1) Configuration Registers (Intel®  
82915G/82915GV/82915GL/ 82910GL Only).................................................................193  
10.1  
Device 2 Function 1 Configuration Register Details (D2:F1).............................194  
10.1.1 VID2—Vendor Identification (D2:F1)..................................................194  
10.1.2 DID2—Device Identification (D2:F1) ..................................................194  
10.1.3 PCICMD2—PCI Command (D2:F1)...................................................195  
10.1.4 PCISTS2—PCI Status (D2:F1)...........................................................196  
10.1.5 RID2—Revision Identification (D2:F1)................................................197  
10.1.6 CC—Class Code Register (D2:F1).....................................................197  
10.1.7 CLS—Cache Line Size (D2:F1)..........................................................197  
10.1.8 MLT2—Master Latency Timer (D2:F1)...............................................198  
10.1.9 HDR2—Header Type Register (D2:F1)..............................................198  
10.1.10 MMADR—Memory Mapped Range Address (D2:F1) ........................198  
10.1.11 SVID2—Subsystem Vendor Identification (D2:F1).............................199  
10.1.12 SID2—Subsystem Identification (D2:F1)............................................199  
10.1.13 ROMADR—Video BIOS ROM Base Address (D2:F1).......................199  
10.1.14 CAPPOINT—Capabilities Pointer (D2:F1) .........................................199  
10.1.15 MINGNT—Minimum Grant Register (D2:F1)......................................200  
10.1.16 MAXLAT—Maximum Latency (D2:F1) ...............................................200  
Datasheet  
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