A
80960JD
Table 11. 132-Lead PQFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Airflow — ft./min (m/sec)
Parameter
0
50
100
200
400
600
800
(0)
(0.25)
(0.50)
(1.01)
(2.03)
(3.04)
(4.06)
qJC (Junction-to-Case)
6
7
7
7
7
7
9
7
8
qCA (Case-to-Ambient -No Heatsink)
23
20
18
14
10
qCA
qJA
qJC
qJB
qJL
NOTES:
1. This table applies to a PQFP device soldered directly into board.
2.
3.
4.
q
q
q
= q + q
= 18°C/W (approx.)
= 18°C/W (approx.)
JA
JL
JB
JC
CA
65
60
55
50
45
40
35
30
0
100
200
300
400
500
600
700
800
AIRFLOW (ft/min)
PGA with unidirectional heatsink
PGA with no heatsink
PGA with omnidirectional heatsink
Figure 6. 50 MHz Maximum Allowable Ambient Temperature
21
PRELIMINARY
INTEL [ INTEL ]
