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80960JD-40 参数 Datasheet PDF下载

80960JD-40图片预览
型号: 80960JD-40
PDF下载: 下载PDF文件 查看货源
内容描述: 嵌入式32位微处理器 [EMBEDDED 32-BIT MICROPROCESSOR]
分类和应用: 微处理器
文件页数/大小: 61 页 / 1555 K
品牌: INTEL [ INTEL ]
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80960JD  
A
TJ = TC + P (qJC  
)
3.2  
Package Thermal Specifications  
Similarly, if TA is known, the corresponding case  
temperature (TC) can be calculated as follows:  
The 80960JD is specified for operation when TC  
(case temperature) is within the range of 0°C to 85°C  
for the (PGA) 80960JD-50, or 0°C to 100°C for the  
(PQFP and PGA) 80960JD-40 and 80960JD-33.  
Case temperature may be measured in any  
environment to determine whether the 80960JD is  
within specified operating range. The case temper-  
ature should be measured at the center of the top  
surface, opposite the pins.  
TC = TA + P (qCA  
)
Compute P by multiplying ICC from Table 14 and  
VCC. Values for qJC and qCA are given in Table 10 for  
the PGA package and Table 11 for the PQFP  
package. For high speed operation, the processor’s  
qJA may be significantly reduced by adding  
a
heatsink and/or by increasing airflow.  
qCA is the thermal resistance from case to ambient.  
Figure 6 shows the maximum ambient temperature  
(TA) permitted without exceeding TC for the  
80960JD-50 in a PGA package. Figure 7 illustrates  
this for the 80960JD-40 in PGA and PQFP  
packages. The curves are based on minimum ICC  
(hot) and maximum VCC of +5.25 V, with a TCASE of  
+85°C for the 80960JD-50, or a TCASE of +100°C for  
the 80960JD-40.  
Use the following equation to calculate TA, the  
maximum ambient temperature to conform to  
particular case temperature:  
a
TA = TC - P (qCA  
)
Junction temperature (TJ) is commonly used in  
reliability calculations. TJ can be calculated from qJC  
(thermal resistance from junction to case) using the  
following equation:  
Table 10. 132-Lead PGA Package Thermal Characteristics  
Thermal Resistance — °C/Watt  
Airflow — ft./min (m/sec)  
200 400 600 800  
(1.01) (2.03) (3.04) (4.06) (5.08)  
Parameter  
0
1000  
(0)  
qJC (Junction-to-Case)  
3
3
3
12  
9
3
11  
8
3
11  
8
3
11  
8
qCA (Case-to-Ambient) (No Heatsink)  
18  
15  
14  
15  
12  
11  
qCA (Case-to-Ambient) (Omnidirectional Heatsink)  
qCA (Case-to-Ambient) (Unidirectional Heatsink)  
8
7
7
7
qJA  
qCA  
qJC  
qJ-PIN  
qJ-CAP  
NOTES:  
1. This table applies to a PGA device plugged into a socket or soldered directly into a board.  
2.  
3.  
4.  
5.  
q
q
q
q
= q + q  
JA  
JC  
CA  
= 4°C/W (approx.)  
J-CAP  
J-PIN  
J-PIN  
= 4°C/W (inner pins) (approx.)  
= 8°C/W (outer pins) (approx.)  
20  
PRELIMINARY  
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