Electrical, Power, and Thermal
4.4.12
Reference DDR2 Interface Package Trace Lengths
The following reference package trace lengths have been incorporated into the Advance
Memory Buffer timings in
Table 4-9.
Advance Memory Buffer DDR2 Package Lengths
Signal Group
CLK/CLK
Command/Address
CKE, CS#
ODT
DQS/DQS/DQ
Min Length
24
4
9
10
9
Max Length
26
20
22
16
13
Units
mm
mm
mm
mm
mm
4.5
SMBUS Interface
Table 4-10. Recommended Operating Conditions for SMBUS Interface
Symbol
V
DDSPD
V
IL
V
IH
V
OL
I
LEAK-BUS
I
LEAK-PIN
I
PULLUP
C
BUS
C
I
V
NOISE
Parameter
Supply voltage (SMBUS)
SMBus signal input low voltage
SMBus signal input high voltage
SMBus signal output low voltage
Input Leakage per bus segment
Input Leakage per device pin
Current sinking, V
OL
= 0.4V
Capacitive load per bus segment
Capacitance for SMBDAT or
SMBCLK pin
Signal noise immunity from
10MHz to 100MHz
Min
3.0
-
2.1
-
-
-
4
-
-
300
Typ
3.3
-
-
-
-
-
-
-
-
-
Max
3.6
0.8
V
DDSPD
0.4
+200
+10
-
400
10
-
Unit
V
V
V
V
µA
µA
mA
pF
pF
mV p-p
This is AC item applies to
the high-power DC
specification only
@I
PULLUP
Comments
3.3v +10%
Note:
Based on High-power SMBus DC Specification
4.6
Miscellaneous I/O (1.5 Volt CMOS Driver)
Table 4-11. Recommended Operating Conditions for RESET and BFUNC Pins
Symbol
V
IH(dc)
V
IL(dc)
ILEAK
Parameter
DC HIGH-level input voltage
DC LOW-level input voltage
Input leakage
Min
1.0
-
-
Typ
-
-
-
Max
-
0.5
+ 90
Unit
V
V
µA
Comments
4.7
Thermal Diode and Analog to Digital Converter
(ADC)
A thermal diode with an analog to digital converter (ADC) is required. The thermal
sensor will be used to ensure prevention of catastrophic failure.
Intel® 6400/6402 Advanced Memory Buffer Datasheet
51
INTEL [ INTEL CORPORATION ]
