Electrical, Power, and Thermal
4.1.3
AMB Power Specifications
contains the AMB power specifications related to parameters stored in the
SPD for the AMB .
Table 4-3.
Power Values for x8 DIMMS (Sheet 1 of 3)
533 MHz
667 MHz
Thermal
Design
2.4
0.6
Max
Current
2.6
0.7
Units
A
A
A
Notes
Symbol
Idd_Idle_0
Conditions
Idle Current, single or
last DIMM
L0 state, idle (0 BW)
Primary channel
enabled, Secondary
Channel Disabled
CKE high. Command
and address lines
stable.
DRAM clock active.
Power
Supply
@1.5 V
@1.8 V
@3.3 V
Thermal
Design
2.1
0.6
Max
Current
2.2
0.7
Idd_Idle_0 Total Power
Idd_Idle_1
Idle Current, first DIMM
L0 state, idle (0 BW)
Primary and Secondary
channels enabled
CKE high. Command
and address lines
stable.
DRAM clock active.
@1.5 V
@1.8 V
@3.3 V
3.5
2.7
0.6
3.0
0.7
4.0
3.1
0.6
3.4
0.7
W
A
A
A
Idd_Idle_1 Total Power
Idd_TDP_0
(for AMB spec,
Not in SPD)
Active Power, TDP BW,
Single or Last DIMM
L0 state
TDP Channel BW =
2.0GB/s@533; 2.4GB/
s@667;
DIMM BW = 2.0GB/
s@533; 2.4GB/s@667;
67% read, 33% write.
Primary channel
Enabled
Secondary channel
Disabled
CKE high. Command
and Address
@1.5 V
@1.8 V
@3.3 V
4.6
2.4
1.1
2.6
1.3
5.1
2.8
1.2
3.0
1.3
W
A
A
A
Idd_TDP_0 Total Power
Idd_TDP_1
(for AMB spec,
Not in SPD)
Active Power, TDP BW,
First DIMM
L0 state
TDP Channel BW =
2.0GB/s@533; 2.4GB/
s@667;
DIMM BW =2/3 Channel
BW = 1.3GB/s@533;
1.6GB/s@667;
67% read, 33% write.
Primary channel
Enabled
Secondary channel
Enabled
CKE high. Command
and Ad
@1.5 V
@1.8 V
@3.3 V
5.2
3.0
0.9
3.3
1.0
5.8
3.5
0.9
3.8
1.0
W
A
A
A
38
Intel® 6400/6402 Advanced Memory Buffer Datasheet
INTEL [ INTEL CORPORATION ]
