Electrical, Power, and Thermal
4.1.3
AMB Power Specifications
Table 4-3 contains the AMB power specifications related to parameters stored in the
SPD for the AMB .
Table 4-3.
Power Values for x8 DIMMS (Sheet 1 of 3)
533 MHz
667 MHz
Power
Supply
Thermal
Design
Max
Current
Thermal
Design
Max
Current
Symbol
Conditions
Units
Notes
Idd_Idle_0
Idle Current, single or
last DIMM
L0 state, idle (0 BW)
Primary channel
enabled, Secondary
Channel Disabled
@1.5 V
@1.8 V
@3.3 V
2.1
2.2
0.7
2.4
2.6
0.7
A
A
A
0.6
0.6
CKE high. Command
and address lines
stable.
DRAM clock active.
Idd_Idle_0 Total Power
3.5
2.7
0.6
4.0
3.1
0.6
W
A
Idd_Idle_1
Idle Current, first DIMM @1.5 V
3.0
0.7
3.4
0.7
L0 state, idle (0 BW)
Primary and Secondary
@1.8 V
A
channels enabled
@3.3 V
A
CKE high. Command
and address lines
stable.
DRAM clock active.
Idd_Idle_1 Total Power
4.6
2.4
1.1
5.1
2.8
1.2
W
A
Idd_TDP_0
Active Power, TDP BW,
Single or Last DIMM
@1.5 V
@1.8 V
@3.3 V
2.6
1.3
3.0
1.3
A
L0 state
(for AMB spec,
Not in SPD)
TDP Channel BW =
2.0GB/s@533; 2.4GB/
s@667;
A
DIMM BW = 2.0GB/
s@533; 2.4GB/s@667;
67% read, 33% write.
Primary channel
Enabled
Secondary channel
Disabled
CKE high. Command
and Address
Idd_TDP_0 Total Power
5.2
3.0
0.9
5.8
3.5
0.9
W
A
Idd_TDP_1
Active Power, TDP BW,
First DIMM
@1.5 V
@1.8 V
@3.3 V
3.3
1.0
3.8
1.0
A
L0 state
(for AMB spec,
Not in SPD)
TDP Channel BW =
2.0GB/s@533; 2.4GB/
s@667;
A
DIMM BW =2/3 Channel
BW = 1.3GB/s@533;
1.6GB/s@667;
67% read, 33% write.
Primary channel
Enabled
Secondary channel
Enabled
CKE high. Command
and Ad
38
Intel® 6400/6402 Advanced Memory Buffer Datasheet
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