欢迎访问ic37.com |
会员登录 免费注册
发布采购

6400 参数 Datasheet PDF下载

6400图片预览
型号: 6400
PDF下载: 下载PDF文件 查看货源
内容描述: 高级内存缓冲器 [Advanced Memory Buffer]
分类和应用:
文件页数/大小: 250 页 / 3863 K
品牌: INTEL [ INTEL ]
 浏览型号6400的Datasheet PDF文件第31页浏览型号6400的Datasheet PDF文件第32页浏览型号6400的Datasheet PDF文件第33页浏览型号6400的Datasheet PDF文件第34页浏览型号6400的Datasheet PDF文件第36页浏览型号6400的Datasheet PDF文件第37页浏览型号6400的Datasheet PDF文件第38页浏览型号6400的Datasheet PDF文件第39页  
DDR Interface  
3.9  
DIMM Organization  
The AMB supports DIMMs with 1 or 2 independent ranks (chip-selects). Each rank  
consists of DDR SDRAM devices or DDR SDRAM devices. Dual rank DIMMs consist of  
DDR SDRAM devices or DDR SDRAM devices.  
The AMB DDR I/O circuits provide three main functions: an outbound command and  
data path, an inbound data path, and analog compensation.  
Analog compensation is provided, along with configuration registers, to control and  
match the output impedance and slew rate of the off-chip drivers and on on-die  
termination. The main configuration registers are the leg override (for impedance) and  
slew override fields of the spdpar67cur and spdpar1011cur CSR’s. The analog  
compensation circuits match driver characteristics to a ratio of an externally provided  
resistance. The CSR’s control the ratio.  
The outbound data path is relatively simple compared to the inbound. On the outbound  
command, the I/O circuits provide a minimum latency, registered path to transfer  
commands from the core to the DDR command bus as quickly as possible, but with  
tight timing control. For the DQ, DQS, and DRAM clock outputs, the I/O provides  
registered paths to transfer these signals to the DDR bus with the proper phase  
relationship to the command. The phase of the DRAM clocks (along with the DQS and  
DQ phase) relative to the command can be controlled by the ddr1xphsel and ca2xphsel  
fields of the spdpar45cur and spdpar67cur CSR’s.  
The inbound data path includes calibrated receiver enable circuits, calibrated DQS delay  
lines, and an eight entry deep levelization FIFO. Calibration is controlled by the core at  
power up and can take several ms to execute. Calibration involves a series of read and  
write operations to the DRAM. Receiver enable is calibrated on a per byte basis. DQS  
delay is calibrated at a coarse level on a word basis, with a fine calibration adjustment  
for each nibble. The fine adjustment can be dynamic so that a different calibration  
value can be sent from the core for each nibble depending on which rank is being  
accessed. The core provides a read pointer to access the contents of the FIFO. The IO  
I/O circuits manage the FIFO write pointer automatically, with timing based on both the  
receiver enable and DQS delay calibrations.  
§
Intel® 6400/6402 Advanced Memory Buffer Datasheet  
35  
 复制成功!