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550 参数 Datasheet PDF下载

550图片预览
型号: 550
PDF下载: 下载PDF文件 查看货源
内容描述: 奔腾4处理器,支持超线程技术 [Pentium 4 Processors Supporting Hyper-Threading Technology]
分类和应用:
文件页数/大小: 96 页 / 1585 K
品牌: INTEL [ INTEL ]
 浏览型号550的Datasheet PDF文件第71页浏览型号550的Datasheet PDF文件第72页浏览型号550的Datasheet PDF文件第73页浏览型号550的Datasheet PDF文件第74页浏览型号550的Datasheet PDF文件第76页浏览型号550的Datasheet PDF文件第77页浏览型号550的Datasheet PDF文件第78页浏览型号550的Datasheet PDF文件第79页  
Thermal Specifications and Design Considerations  
5 Thermal Specifications and  
Design Considerations  
5.1  
Processor Thermal Specifications  
The Pentium 4 processor in the 775-land package requires a thermal solution to maintain  
temperatures within operating limits as set forth in Section 5.1.1. Any attempt to operate the  
processor outside these operating limits may result in permanent damage to the processor and  
potentially other components within the system. As processor technology changes, thermal  
management becomes increasingly crucial when building computer systems. Maintaining the  
proper thermal environment is key to reliable, long-term system operation.  
A complete thermal solution includes both component and system level thermal management  
features. Component level thermal solutions can include active or passive heatsinks attached to the  
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of  
system fans combined with ducting and venting.  
®
For more information on designing a component level thermal solution, refer to the Intel  
®
Pentium 4 Processor on 90 nm Process in the 775-Land Package Thermal Design Guidelines.  
Note: The boxed processor will ship with a component thermal solution. Refer to Chapter 7 for details on  
the boxed processor.  
5.1.1  
Thermal Specifications  
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the  
system/processor thermal solution should be designed such that the processor remains within the  
minimum and maximum case temperature (T ) specifications when operating at or below the  
C
Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not  
designed to provide this level of thermal capability may affect the long-term reliability of the  
processor and system. For more details on thermal solution design, refer to the appropriate  
processor thermal design guidelines.  
The Pentium 4 processor in the 775-land package introduces a new methodology for managing  
processor temperatures which is intended to support acoustic noise reduction through fan speed  
control. Selection of the appropriate fan speed will be based on the temperature reported by the  
processor’s thermal diode. If the diode temperature is greater than or equal to T  
, the  
CONTROL  
processor case temperature must remain at or below the temperature as specified by the thermal  
profile. If the diode temperature is less than T then the case temperature is permitted to  
CONTROL  
exceed the thermal profile, but the diode temperature must remain at or below T  
. Systems  
CONTROL  
that implement fan speed control must be designed to take these conditions into account. Systems  
that do not alter the fan speed only need to guarantee the case temperature meets the thermal profile  
specifications.  
To determine a processor's case temperature specification based on the thermal profile, it is  
necessary to accurately measure processor power dissipation.  
Datasheet  
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