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550 参数 Datasheet PDF下载

550图片预览
型号: 550
PDF下载: 下载PDF文件 查看货源
内容描述: 奔腾4处理器,支持超线程技术 [Pentium 4 Processors Supporting Hyper-Threading Technology]
分类和应用:
文件页数/大小: 96 页 / 1585 K
品牌: INTEL [ INTEL ]
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Thermal Specifications and Design Considerations  
5.1.2  
Thermal Metrology  
The maximum and minimum case temperatures (T ) are specified in Table 5-1. These temperature  
C
specifications are meant to help ensure proper operation of the processor. Figure 5-3 illustrates  
where Intel recommends T thermal measurements should be made. For detailed guidelines on  
C
®
®
temperature measurement methodology, refer to the Intel Pentium 4 Processor on 90 nm  
Process in the 775-Land Package Thermal Design Guidelines.  
Figure 5-3. Case Temperature (T ) Measurement Location  
C
Measure TC at this point  
(geometric center of the package)  
37.5 mm  
5.2  
Processor Thermal Features  
5.2.1  
Thermal Monitor  
The Thermal Monitor feature helps control the processor temperature by activating the TCC when  
the processor silicon reaches its maximum operating temperature. The TCC reduces processor  
power consumption as needed by modulating (starting and stopping) the internal processor core  
clocks. The Thermal Monitor feature must be enabled for the processor to be operating  
within specifications. The temperature at which Thermal Monitor activates the thermal control  
circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal  
manner, and interrupt requests are latched (and serviced during the time that the clocks are on)  
while the TCC is active.  
When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e., TCC is  
active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle  
specific to the processor (typically 30–50%). Clocks often will not be off for more than  
3.0 microseconds when the TCC is active. Cycle times are processor speed dependent and will  
decrease as processor core frequencies increase. A small amount of hysteresis has been included to  
prevent rapid active/inactive transitions of the TCC when the processor temperature is near its  
maximum operating temperature. Once the temperature has dropped below the maximum  
operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock  
modulation ceases.  
Datasheet  
79  
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