Thermal Specifications and Design Considerations
The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power
consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature
must be enabled for the processor to remain within specification.
Table 5-1. Processor Thermal Specifications
Processor
Number
Core Frequency
(GHz)
Thermal Design Minimum TC
Maximum TC (°C)
Notes
Power (W)
(°C)
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
520/521
530/531
540/541
550/551
550
2.80 (PRB = 0)
3 (PRB = 0)
84
84
5
5
5
5
5
5
5
See Table 5-3 and Figure 5-2
See Table 5-3 and Figure 5-2
See Table 5-3 and Figure 5-2
See Table 5-3 and Figure 5-2
See Table 5-2 and Figure 5-1
See Table 5-2 and Figure 5-1
See Table 5-2 and Figure 5-1
3.20 (PRB = 0)
3.40 (PRB = 0)
3.40 (PRB = 1)
3.60 (PRB = 1)
3.80 (PRB = 1)
84
84
115
115
115
560/561
570/571
NOTES:
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum pow-
er that the processor can dissipate.
2.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum T will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table
C
for the allowed combinations of power and T .
C
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Datasheet
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