Package Mechanical Specifications and Pin Information
Table 12.
Micro-FCPGA Package Dimensions
Symbol
Parameter
Min
Max
Unit
A
Overall height, top of the die to package seating plane
1.88
2.02
mm
Overall height, top of die to PCB surface, including
socket (Refer to Note 1)
–
4.74
1.95
5.16
2.11
mm
A1
A2
A3
B
Pin length
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
each
kPa
g
Die height
0.820
Pin-side capacitor height
Pin diameter
–
1.25
0.36
35.1
35.1
0.28
34.9
34.9
D
Package substrate length
Package substrate width
Die length
E
D1
E1
e
12.54
Die width
6.99
1.27
5
Pin pitch
K
Package edge keep-out
Package corner keep-out
Pin-side capacitor boundary
Pin count
K1
K3
N
7
14
478
Pdie
W
Allowable pressure on the die for thermal solution
Package weight
-
689
4.5
Package surface flatness
0.286
mm
NOTES:
1.
Overall height with socket is based on design dimensions of the Micro-FCPGA package with
no thermal solution attached. Values are based on design specifications and tolerances.
This dimension is subject to change based on socket design, OEM motherboard design or
OEM SMT process.
32
Datasheet
INTEL [ INTEL ]
