Package Mechanical Specifications and Pin Information
4
Package Mechanical
Specifications and Pin
Information
The Celeron M processor will be available in 478-pin, Micro-FCPGA and 479-ball, Micro-
FCBGA packages. Different views of the Micro-FCPGA package are shown in Figure 7
through Figure 9. Package dimensions are shown in Figure 7. Different views of the
Micro-FCBGA package are shown in Figure 7 through Figure 9. Package dimensions are
shown in Table 8.
The Micro-FCBGA package may have capacitors placed in the area surrounding the die.
Because the die-side capacitors are electrically conductive, and only slightly shorter
than the die height, care should be taken to avoid contacting the capacitors with
electrically conductive materials. Doing so may short the capacitors, and possibly
damage the device or render it inactive. The use of an insulating material between the
capacitors and any thermal solution should be considered to prevent capacitor shorting.
Figure 7.
Micro-FCPGA Package Top and Bottom Isometric Views
PACKAGE KEEPOUT
CAPACITOR AREA
DIE
LABEL
TOP VIEW
BOTTOM VIEW
NOTE: All dimensions in millimeters. Values shown for reference only. Refer to Table 12 for
details.
Datasheet
29
INTEL [ INTEL ]
