Package Mechanical Specifications and Pin Information
Table 13.
Micro-FCPGA Package Dimensions
Symbol
Parameter
Min
Max
Unit
A
A2
b
Overall height, as delivered (Refer to Note 1)
Die height
2.60
2.85
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
each
mm
kPa
g
0.82
0.78
Ball diameter
D
Package substrate length
Package substrate width
Die length
34.9
34.9
35.1
35.1
E
D1
E1
e
12.54
6.99
1.27
5
Die width
Ball pitch
K
Package edge keep-out
Package corner keep-out
Die-side capacitor height
Package edge to first ball center
Ball count
K1
K2
S
7
–
–
0.7
1.625
479
N
–
Solder ball coplanarity
Allowable pressure on the die for thermal solution
Package weight
0.2
Pdie
W
689
4.5
NOTES:
1.
Overall height as delivered. Values are based on design specifications and tolerances. This
dimension is subject to change based on OEM motherboard design or OEM SMT process
Datasheet
35
INTEL [ INTEL ]
