Package Mechanical Specifications
3 Package Mechanical
Specifications
The Celeron D processor is packaged in a Flip-Chip Pin Grid Array (FC-mPGA4) package that
interfaces with the motherboard via a mPGA478B socket. The package consists of a processor core
mounted on a substrate pin-carrier. An integrated heat spreader (IHS) is attached to the package
substrate and core and serves as the mating surface for processor component thermal solutions
(such as a heatsink). Figure 3-1 shows a sketch of the processor package components and how they
are assembled together. Refer to the mPGA479, mPGA478A, mPGA478B, mPGA478C, and
mPGA476 Socket Design Guidelines for complete details on the mPGA478B socket.
The package components shown in Figure 3-1 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Figure 3-1. Processor Package Assembly Sketch
CORE (DIE)
IHS
TIM
SUBSTRATE
CAPACITORS
SOCKET
MOTHERBOARD
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 and Figure 3-3. The drawings include
dimensions necessary to design a thermal solution for the processor. These dimensions include:
• Package reference with tolerances (total height, length, width, etc.)
• IHS parallelism and tilt
• Pin dimensions
• Top-side and back-side component keep-out dimensions
• Reference datums
All drawing dimensions are in mm [in].
Datasheet
31
INTEL [ INTEL ]
